Process Engineer (SiPFAB), 3 positions - Työmarkkinatori - Tampere, Finland

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. www.tuni.fi/en Tampere University System-in-Package Fabrication (SiPFAB) is now looking for three Process Engineers. System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions. SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for industrial applications in transportation and energy systems. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging for the industry— from concept to prototype and pre-production. SiPFAB is part of the Chips JU Wide Band Gap Pilot Line, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem. The national nodes of the WBG Pilot line will host different cleanroom facilities enabling the transition from research to industrial-scale production in the WBG and Ultra-WBG semiconductor technologies, consolidating Europe's autonomy in the semiconductor sector. Read more about the WBG Pilot Line. Tampere University and Tampere University of Applied Sciences create a multidisciplinary, inspiring, and impactful research and education environment. Our community's strength lies in technology, health and society. www.tuni.fi/en Tampere University System-in-Package Fabrication (SiPFAB) is now recruiting three process engineers. As a process engineer specializing in either grinding and dicing or back-end processes for next-generation semiconductor packaging, you will lead process development such as flip-chip bonding, die and wire bonding, screen printing, reflow, sintering, dispensing, encapsulation, or dicing and grinding. Working in a multidisciplinary team, you will contribute to customer projects with academia, research institutes, and industry, promoting advanced packaging technology demonstration, maturation, and commercialization. You will also play a key role in process control, tool procurement, safety, user training, and equipment lifecycle management, ensuring a strong and scalable process foundation for SiPFAB. Your responsibilities include establishing, developing, and optimizing soldering, sintering, ultrasonic, and laser welding or dicing and grinding processes for semiconductor packaging applications. You will actively participate in ongoing and future R&D and customer projects, collaborate with academic, research, and industrial partners, select and procure process tools and equipment, oversee installation, qualification, and maintenance, conduct root cause analysis, troubleshoot, and implement corrective actions, work closely with vendors and suppliers, and ensure documentation, safety compliance, and training. You are a proactive engineer who enjoys hands-on experimentation, problem solving, and working in an evolving cleanroom environment. You hold a master's or doctoral degree in a relevant field such as mechanical or electrical engineering, physics, materials science, or semiconductor packaging technology, with at least 3 years of relevant experience. Proven experience in semiconductor packaging, soldering, sintering, welding, encapsulation, and/or dicing processes is required. You understand safety protocols and material handling, have a structured approach to problem solving, a hands-on mindset, and effective communication skills in English. Assets include experience in the semiconductor or microelectronics industry, background in pilot-line environments, familiarity with process development and control methods (DOE, SPC), interest in industry trends, and Finnish language skills. Tampere University values openness, diversity, responsibility, courage, critical thinking, erudition, and learner-centeredness. We offer a high-autonomy environment, impactful work, collaboration opportunities, and competitive benefits such as flexible hours, teleworking, occupational healthcare, campus amenities, and a personal fund for sports and cultural activities.