Design, Simulation and Modelling Engineer for Advanced Semiconductor Packaging (SiPFAB) - Tampereen yliopisto - Remote - Global

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. Tampere University System-in-Package Fabrication (SiPFAB) is establishing a new infrastructure at the Faculty of Information Technology and Communication Sciences (ITC). Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing, providing a platform for developing environmentally friendly, customized chip systems and supporting research in emerging chip technologies. The role involves leading the development of design, modelling, and simulation processes for semiconductor packaging, collaborating with academia, research institutes, and industry, and exploring AI-driven design methodologies. Requirements include a MSc or PhD in Electrical, Physics, Materials Science, or Semiconductor Packaging, with at least 5 years of relevant experience, and fluency in English. The position offers high autonomy, impact, and collaboration opportunities, with a competitive salary based on Finnish University Salary System. The appointment is permanent, with a start date as soon as possible, and a six-month trial period. Application deadline is 3.8.2026.