Design, Simulation and Modelling Engineer for Advanced Semiconductor Packaging (SiPFAB) - Tampereen yliopisto - Remote - Global

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. Tampere University System-in-Package Fabrication (SiPFAB) is establishing a new infrastructure at the Faculty of Information Technology and Communication Sciences (ITC). Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing, providing a platform for developing environmentally friendly, customized chip systems and supporting research in emerging chip technologies. The role involves leading the development of design, modelling, and simulation processes for semiconductor packaging, collaborating with academic, research, and industry partners, and exploring AI-driven design methodologies. Requirements include a MSc or PhD in Electrical, Physics, Materials Science, or Semiconductor Packaging, with at least 5 years of relevant experience, and fluency in English. The position offers a permanent contract, competitive salary based on Finnish University Salary System, and benefits such as flexible work hours, occupational healthcare, and support for sports and cultural activities. The application deadline is August 3, 2026.