Team Leader

Estimated from 967 comparable listings

Estimated 2026 take-home pay after Finnish income tax, pension, and unemployment insurance contributions. Assumes the national average municipal tax rate (7.57%), no church tax, and standard deductions only; your actual net pay depends on your municipality, church membership, age, and family situation.

• Lead, coach, and develop engineers working on backend fabrication, advanced packaging, and process integration
• Set development priorities and allocate resources against QPU roadmaps, project needs, technical risk, and cleanroom capacity
• Drive technology maturation from research and proof of concept into robust, transferable fabrication processes
• Define development plans, technical milestones, success criteria, and process-readiness expectations
• Guide hypothesis-driven experiments, review results and technical conclusions with the team, and decide the next iteration
• Keep development work data-based, traceable, and tied to QPU and product requirements
• Judge when a process is mature enough to hand to Process Engineering or Production
• Identify and manage technical risks, process dependencies, blockers, and capability gaps
• Work across R&D, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production to keep backend development aligned
• Keep progress, priorities, risks, resource needs, and key decisions visible to your manager and stakeholders

• Master’s degree in materials science, physics, electrical or chemical engineering, nanotechnology, microelectronics, or related discipline
• 5+ years in semiconductor manufacturing, microelectronics, advanced packaging, quantum technologies, or comparable high-tech industry
• 2–3+ years leading technical teams
• Hands-on backend process development and process integration experience
• Track record of taking technology from early phase to engineering or production readiness
• Strong data-driven decision making and structured problem solving
• Stakeholder management and cross‑functional collaboration
• Comfort with uncertainty in fast-moving R&D environment
• English proficiency
• Advantageous: cleanroom operations and safety leadership
• Depth in advanced packaging technologies: flip‑chip, wafer‑level packaging, TSV
• Experience building up a new team or function in scaling organization
• Familiarity with quantum computing, cryogenics, or advanced hardware R&D

1. Submit application
2. Interviews
3. Decision and offer