Process Engineer

Tampere University System-in-Package Fabrication (SiPFAB) is now looking for three Process Engineers. System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions. SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for industrial applications in transportation and energy systems. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging for the industry— from concept to prototype and pre-production. SiPFAB is part of the Chips JU Wide Band Gap Pilot Line, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem. JOB DESCRIPTION SiPFAB aims to fill up to three Process Engineer roles. As a Process Engineer specializing in either grinding and dicing or back-end processes for next‑generation semiconductor packaging, you will lead the development of processes such as flip-chip bonding, die and wire bonding, screen printing, reflow, sintering, dispensing, encapsulation or dicing and grinding within our semiconductor packaging pilot‑line environment. Working as part of a multidisciplinary team, you will contribute directly to customer projects spanning academia, research institutes, and industry driving the demonstration, maturation, and commercialization of advanced packaging technologies. In this role, you will also play a key part in process control, tool procurement, safety, user training, and equipment lifecycle management ensuring a robust and scalable process foundation for SiPFAB. Your Key Responsibilities You will take ownership of: - Establishing, developing, and optimizing soldering, sintering, ultrasonic and laser welding or dicing and grinding processes for semiconductor packaging applications. - Actively contributing to ongoing and future R&D and customer projects - Engaging and collaborating with academic, RTO, and industrial partners - Selecting, specifying, and procuring process tools and equipment - Overseeing tool installation, qualification, and maintenance activities - Conducting root‑cause analysis, troubleshooting yield or process issues, and driving corrective actions - Working closely with equipment vendors and material suppliers to advance process capability - Ensuring process documentation, safety compliance, and user training within the pilot‑line environment REQUIREMENTS You are a proactive engineer who enjoys hands‑on experimentation, problem solving, and working in an evolving cleanroom environment. Required Skills & Experience - M.Sc. or Ph.D. in an applicable field such as Mechanical or Electrical Engineering, Physics, Materials Science or Semiconductor Packaging Technology - At least 3 years of relevant work experience - Proven experience in semiconductor packaging, soldering, sintering, welding, encapsulation and/or dicing processes - Understanding of safety protocols, and material handling - A strong, structured approach to problem solving and troubleshooting - Hands-on mindset and comfort working directly with process tools - Ability to work effectively in conditions of ambiguity where processes and tools are still evolving - A team player with strong communication and collaboration skills - High attention to detail and process discipline - Fluent spoken and written skills in English Considered as an asset - Experience in the semiconductor or microelectronics industry - Background in pilot-line environments or lab-to-production transitions - Familiarity with process development and control methodologies (DOE, SPC etc.) - Interest in following and understanding trends in the semiconductor packaging industry - Knowledge of the Finnish language WE OFFER At SiPFAB, you will be working at the forefront of European semiconductor development and manufacturing initiatives. We offer a high-autonomy environment designed for proactive, self-driven engineers and opportunities for substantial impact and visibility within both the organization and wider ecosystem. In addition, we offer direct collaboration with researchers, industry partners, and the semiconductor community. This is a key role in shaping and demonstrating breakthrough packaging technologies. At SiPFAB, you will get enthusiastic and awesome colleagues to work with. As a member of staff at Tampere University, you will enjoy a range of competitive benefits, such as a flexible work schedule, good facilities for teleworking, occupational healthcare services, a variety of affordable food and drink outlets across our campuses and a personal fund to spend on sports and cultural activities in your free time. The positions will be filled on permanent basis, commencing preferably as soon as possible mutually agreed. A trial period of six months applies to all our new employees. The salary will be based on both the job requirements and the employee's personal performance in accordance with the Finnish Unversity Salary System. The official job title for the selected candidate will be Specialist. The position of Specialist is placed at requirement levels 9-10 in the salary system (Other Expert and Support Staff).