Prosessi-insinööri (SiPFAB) - Tampereen yliopisto - Etätyö - Globaali

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. Tampere University is establishing a new infrastructure called SiPFAB at the Faculty of Information Technology and Communication Sciences (ITC). Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line offers a platform for combining and testing Wide Bandgap (WBG) chips and semiconductor components as complete system solutions. The role involves leading process development in semiconductor packaging, including processes like flip-chip bonding, die and wire bonding, screen printing, reflow, sintering, dispensing, encapsulation, or dicing and grinding. The candidate will work in a multidisciplinary team, contribute to customer projects, and handle process control, tool procurement, safety, training, and equipment lifecycle management. Requirements include a MSc or PhD in relevant fields, at least 3 years of experience, proven semiconductor packaging process expertise, and fluency in English. Knowledge of Finnish is an asset. The position is permanent, with a salary based on the Finnish University Salary System, at requirement levels 9-10. The official title is Specialist. The application deadline is August 3, 2026. Tampere University offers a flexible work environment, occupational healthcare, and benefits including a personal fund for sports and cultural activities. The role is critical in advancing European semiconductor technologies.