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Design Lead Data Center - Verda - Helsinki, Suomi

Julkaistu: 7. toukokuuta 2026
Julkaistu 24 päivää sitten
Viimeksi nähty crawlissa: 29. toukokuuta 2026 (2pv sitten)
Arvioitu päättymispäivä: 11. kesäkuuta 2026
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Rooli ja johtaminen
Roolitaso:Keskitaso
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Työtehtävän kuvaus

Imagine a future where everyone has instant, low-cost access to intelligence. We’re building a fully featured European AI cloud - with everything one needs to train, experiment with, and deploy AI models. In addition, our GPUs run on 100% renewable energy.We’re ambitious, curious, and gutsy doers. We practice a low hierarchy across the company and high morale in our teams. We’ve already achieved a lot, yet we’re only getting started. Now it’s your chance to join the ride. We offer more than just the job - we offer a career-defining opportunity to be part of building something big!Join Verda while it’s still being built - not once it’s finished.Why VerdaCash + equity compensation along with various fringe benefits (e.g., healthcare, lunch, wellbeing, etc.).Profitable operations with rapid, sustained growth.31 nationalities, with 6 different ones on the management team.An opportunity with make a clear impact and work alongside world-class engineers, researchers, and partners across the global AI ecosystem.The MissionYou are the visionary integrator. You translate the extreme requirements of 100kW+ AI racks into a cohesive, scalable infrastructure—whether it’s a massive hyperscale data hall or a rapid-deployment modular "block." You own the Total System Design, ensuring that power, cooling, and structure work in perfect harmony to create a high-performance compute environment..Key Responsibilities:Integrated Systems Architecture: Lead cross-functional teams (Power, Thermal, Structural) to deliver infrastructure solutions that scale from 1MW modular skids to 100MW+ "own-build" data centers.Standardization & Modularization: Develop a "Productized" approach to data center design, creating standardized, prefabricated building blocks that reduce site-build times and ensure global consistency.Product Roadmap & Lifecycle: Own the design lifecycle from conceptual 3D modeling and BIM coordination to Factory Acceptance Testing (FAT) and final site commissioning.Hybrid Cooling & Power Oversight: Ensure the physical design seamlessly supports a mix of air, RDHx, and liquid cooling (D2C/Immersion) alongside high-density power delivery (Busway-to-Chip).Vendor Ecosystem Orchestration: Select and qualify best-in-class vendors for critical components like CDUs, modular switchgear, and rack manifolds to ensure interoperability.Technical Liaison: Act as the primary bridge between AI hardware silicon teams and the physical facility constraints, ensuring the infrastructure is "future-proofed" for next-gen GPU architectures.Digital Twin Management: Utilization of BIM (Revit) and Digital Twin platforms to simulate deployment scenarios and streamline operations.General Skills & Personal CharacteristicsTo succeed in this team, candidates must look beyond their CAD screens and embrace a high-ownership, peer-to-peer collaboration style:Adaptive Problem Solvers: You don’t wait for a manual. When a 100kW rack presents a new thermal challenge, you iterate quickly and find a path forward.Radical Transparency: You communicate complex technical risks clearly and early. You value "getting it right" over "being right."Holistic Thinkers: Even if you are the Electrical Lead, you understand how a pipe leak affects a busbar. You design with the entire system in mind.Practical Visionaries: You have the "Grand Design" in your head but keep your feet on the ground—focusing on buildability, serviceability, and cost-efficiency.The "Helper Peer" Mentality: You treat your teammates as collaborators, not silos. You are willing to jump into a different discipline to help the team meet a deadline.Outcome-Oriented: You aren’t just "doing engineering"; you are building the foundation for the future of AI. You take pride in seeing your container go from a drawing to a humming 1MW reality.What's nextWe’re building fast and this role needs the right person behind it. There’s no artificial deadline, but when we find who we’re looking for, we move. If this sounds like your next move, apply now.Please submit your application through our Careers page. We <strong>don’t</strong> accept applications sent by email.

Yrityksen tiedot

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Teknologia

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Vastuut

  • Lead cross-functional teams (Power, Thermal, Structural) to deliver infrastructure solutions that scale from 1MW modular skids to 100MW+ "own-build" data centers.
  • Develop a "Productized" approach to data center design, creating standardized, prefabricated building blocks that reduce site-build times and ensure global consistency.
  • Own the design lifecycle from conceptual 3D modeling and BIM coordination to Factory Acceptance Testing (FAT) and final site commissioning.
  • Ensure the physical design seamlessly supports a mix of air, RDHx, and liquid cooling (D2C/Immersion) alongside high-density power delivery (Busway-to-Chip).
  • Select and qualify best-in-class vendors for critical components like CDUs, modular switchgear, and rack manifolds to ensure interoperability.
  • Act as the primary bridge between AI hardware silicon teams and the physical facility constraints, ensuring the infrastructure is "future-proofed" for next-gen GPU architectures.
  • Utilization of BIM (Revit) and Digital Twin platforms to simulate deployment scenarios and streamline operations.

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